Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2011-07-12
2011-07-12
Barr, Michael (Department: 1711)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S104200, C134S172000, C134S198000
Reexamination Certificate
active
07975708
ABSTRACT:
A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region. The third conduits being formed at a first angle relative to the third flat region. The first angle being between 30 and 60 degrees. A system and method for processing a substrate with a proximity head is also described.
REFERENCES:
patent: 3953265 (1976-04-01), Hood
patent: 4086870 (1978-05-01), Canavello et al.
patent: 4367123 (1983-01-01), Beck
patent: 4444492 (1984-04-01), Lee
patent: 4838289 (1989-06-01), Kottman et al.
patent: 5102494 (1992-04-01), Harvey et al.
patent: 5180431 (1993-01-01), Sugimoto et al.
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5294257 (1994-03-01), Kelly et al.
patent: 5343234 (1994-08-01), Kuehnle
patent: 5361449 (1994-11-01), Akimoto
patent: 5472502 (1995-12-01), Batchelder
patent: 5558111 (1996-09-01), Lofaro
patent: 5601655 (1997-02-01), Bok et al.
patent: 5660642 (1997-08-01), Britten
patent: 5705223 (1998-01-01), Bunkofske
patent: 5709757 (1998-01-01), Hatano et al.
patent: 5807522 (1998-09-01), Brown et al.
patent: 5830334 (1998-11-01), Kobayashi
patent: 5882433 (1999-03-01), Ueno
patent: 5893004 (1999-04-01), Yamamura
patent: 5945351 (1999-08-01), Mathuni
patent: 5975098 (1999-11-01), Yoshitani et al.
patent: 5989478 (1999-11-01), Ouellette et al.
patent: 5997653 (1999-12-01), Yamasaka
patent: 6086454 (2000-07-01), Watanabe et al.
patent: 6092937 (2000-07-01), Snodgrass et al.
patent: 6103636 (2000-08-01), Zahorik et al.
patent: 6108932 (2000-08-01), Chai
patent: 6132586 (2000-10-01), Adams et al.
patent: 6214513 (2001-04-01), Cae et al.
patent: 6230722 (2001-05-01), Mitsumori et al.
patent: 6341998 (2002-01-01), Zhang
patent: 6391166 (2002-05-01), Wang
patent: 6398975 (2002-06-01), Mertens et al.
patent: 6417117 (2002-07-01), Davis
patent: 6433541 (2002-08-01), Lehman et al.
patent: 6446358 (2002-09-01), Mitsumori et al.
patent: 6474786 (2002-11-01), Percin et al.
patent: 6488040 (2002-12-01), De Larios et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6495005 (2002-12-01), Colgan et al.
patent: 6514570 (2003-02-01), Matsuyama et al.
patent: 6530823 (2003-03-01), Goodarz et al.
patent: 6531206 (2003-03-01), Johnston et al.
patent: 6550988 (2003-04-01), Sugimoto et al.
patent: 6555017 (2003-04-01), Rushford et al.
patent: 6616772 (2003-09-01), De Larios et al.
patent: 6629540 (2003-10-01), Mitsumori et al.
patent: 6689323 (2004-02-01), Fisher et al.
patent: 6764720 (2004-07-01), Pui et al.
patent: 6799584 (2004-10-01), Yogev et al.
patent: 6851435 (2005-02-01), Mertens et al.
patent: 6854473 (2005-02-01), Hanson et al.
patent: 6954993 (2005-10-01), Smith et al.
patent: 6988326 (2006-01-01), O'Donnell et al.
patent: 6988327 (2006-01-01), Garcia et al.
patent: 7000622 (2006-02-01), Woods et al.
patent: 7069937 (2006-07-01), Garcia et al.
patent: 2002/0121290 (2002-09-01), Tang et al.
patent: 2003/0091754 (2003-05-01), Chihani et al.
patent: 2003/0092264 (2003-05-01), Shinji et al.
patent: 2004/0060573 (2004-04-01), Woods
patent: 2004/0069319 (2004-04-01), Boyd et al.
patent: 2004/0069329 (2004-04-01), De Larios et al.
patent: 2004/0136494 (2004-07-01), Lof et al.
patent: 2004/0178060 (2004-09-01), Ravkin et al.
patent: 2004/0182422 (2004-09-01), Boyd et al.
patent: 2005/0132515 (2005-06-01), Boyd et al.
patent: 2005/0139318 (2005-06-01), Woods et al.
patent: 2005/0145265 (2005-07-01), Ravkin et al.
patent: 2005/0145267 (2005-07-01), Korolik et al.
patent: 2005/0145268 (2005-07-01), Woods
patent: 2005/0148197 (2005-07-01), Woods et al.
patent: 2005/0217703 (2005-10-01), O'Donnell
patent: 2006/0064895 (2006-03-01), Garcia et al.
patent: 2008/0314422 (2008-12-01), O'Donnell et al.
patent: 0 905 746 (1999-03-01), None
patent: 0 905 747 (1999-03-01), None
patent: 1 489 461 (2004-12-01), None
patent: 1 489 462 (2004-12-01), None
patent: 1 571 697 (2005-09-01), None
patent: 1612845 (2006-01-01), None
patent: 1 612 845 (2006-04-01), None
patent: 05837190 (1983-03-01), None
patent: 62150828 (1987-07-01), None
patent: 02280330 (1990-11-01), None
patent: 02309638 (1990-12-01), None
patent: 08277486 (1996-10-01), None
patent: 11031672 (1999-02-01), None
patent: 11350169 (1999-12-01), None
patent: 2003-151948 (2003-05-01), None
patent: 10-2006-0049726 (2006-05-01), None
patent: WO 99/16109 (1999-04-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 02/01613 (2002-01-01), None
patent: WO 02/32825 (2002-04-01), None
patent: WO 02/101795 (2002-12-01), None
patent: WO 03/014416 (2003-02-01), None
patent: WO 2004/030051 (2004-04-01), None
patent: WO 2004/030051 (2004-08-01), None
Owa et al. “Immersion lithography; its potential performance and issues”, Proceedings of the SPIE, SPIE, Bellingham, VA, US, vol. 5040, No. 1, Feb. 28, 2003, pp. 724-733, XP002294500.
Lim et al., “Atomic Layer deposition of transition metals”, Department of Chemistry and Chemical Biology, Harvard University, Nature Publishing Group, vol. 2, Nov. 2003, pp. 749-754.
ICKnowledge LLC, “Technology Backgrounder: Atomic Layer Deposition”, ICKnowledge.com, 2004, pp. 1-7.
“Chemical vapor deposition”, Wikipedia, the free encyclopedia, http://en.wikipedia.org/wiki/Chemical—vapor—deposition, 2005, p. 1-2.
Sigma-Aldrich, “Atomic Layer Deposition(ALD)”, http://www.sigmaaldrich.com/Area—of—Interest/Chemistry/Materials—Science/Thin—Films, 2005, pp. 1-2.
J.A. Britten, “A moving-zone Marangoni drying process for critical cleaning and wet processing,” Oct. 1997,Solid State Technology.
International Search Report—PCT/US2008/002414—Jul. 30, 2008 (4 pages).
de Larios John M.
Freer Erik M.
Korolik Mikhail
Ravkin Michael
Redeker Fred C.
Barr Michael
Heckert Jason
Lam Research Corporation
Martine & Penilla & Gencarella LLP
LandOfFree
Proximity head with angled vacuum conduit system, apparatus... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Proximity head with angled vacuum conduit system, apparatus..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Proximity head with angled vacuum conduit system, apparatus... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2650412