Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Reexamination Certificate
2011-08-02
2011-08-02
Nguyen, Khanh (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
C156S510000
Reexamination Certificate
active
07987886
ABSTRACT:
A chuck table is configured with a table main body having a wafer placement part holding a wafer placed thereon, and an annular tape support frame provided outside the wafer placement part with a cutter blade traveling groove being interposed therebetween. The tape support frame has, at a top face thereof, a plurality of linear grooves arranged in parallel in a tape joining direction, a large number of linear tape support parts each located between the linear grooves, and an annular tape support part supporting the protective tape at an outer side of the cutter blade traveling groove.
REFERENCES:
patent: 5472554 (1995-12-01), Ko et al.
patent: 5688354 (1997-11-01), Ko et al.
patent: 2009/0151875 (2009-06-01), Nonaka et al.
patent: 2004-47976 (2004-02-01), None
patent: WO 2007049441 (2007-05-01), None
Kaneshima Yasuji
Yamamoto Masayuki
Blades John
Cheng Law Group PLLC
Nguyen Khanh
Nitto Denko Corporation
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