Adhesive bond and method for the production thereof

Details Adhesive bond and method for the production thereof Adhesive bond and method for the production thereof

2011-06-07

2011-06-07

Zacharia, Ramsey (Department: 1787)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

C428S411100, C428S421000

Reexamination Certificate

active

07955697

ABSTRACT:
The invention relates to an adhesive bond of a substrate material (1), whose surface and surface-near solid area contain polymer compounds with low active surface energy, and another material (4) and a method for the production of a corresponding adhesive bond. The invention more particularly relates to an adhesive metallized fluoropolymer, such as polytetrafluorethylene (PTFE), as a base material for printed circuit boards having a very high structural density (fine and very fine printed circuit boards) used in the GHz range and to a method for adhesive metallization of a corresponding fluoropolymer. According to the invention, the adhesive bond is formed by a nanostructured transition area (6), containing nanocomposites, between the substrate material (1) and the other material (4), inside which the substrate material (4) which is nanostructured changes into the other material (4). The nanocomposites are composed of substrate material (1) and the other material (4). The material parts of the nanocomposites change from the substrate material (1) in the direction of the other material (1), starting with predominantly substrate material which becomes predominantly the other material (4). According to the invention, the adhesive bond is produced by physically and/or chemically exciting a nano-indented surface of the substrate material (1) and by applying the other material (4) in the form of particles during the excited state until the surface of the other substrate material (1) is fully coated with the other material (4).

REFERENCES:
patent: 4199650 (1980-04-01), Mirtich et al.
patent: 4390567 (1983-06-01), Liepins
patent: 6342307 (2002-01-01), Menezes et al.
patent: 19817388 (1999-10-01), None
patent: 10163437 (2003-07-01), None
patent: 0 502 633 (1992-09-01), None
patent: 816641 (1959-07-01), None
patent: WO0242514 (2002-05-01), None
patent: WO2004015161 (2004-02-01), None
Database WPI, Section Ch, Week 199122, Derwent Publications Ltd., London, GB; AN 1991-161215 XP002332108 & JP 03 097861 A (Matsushita Elec Ind Co Ltd) Apr. 23, 1991 abstract.
Kupfer H et al: “Plasma and ion beam assisted metallization of polymers and their application” Nuclear Instruments & Methods in Physics Research, Section-B: Beam Interactions with Materials and Atoms, North-Holland Publishing Company. Amsterdam, NL, vol. 166-167, May 2000,pp. 722-731, XP004204165, ISSN: 0168-583X—abstract p. 723, right-hand column, line 10—p. 724, left-hand column, last line; figures; table 1 p. 724, right-hand column, paragraph 3.1.
Ratchev B A et al: “Ion beam modification of metal-polymer interfaces for improved adhesion” Nuclear Instruments & Methods in Physics Research, Section-B: Beam Interactions With Materials and Atoms, North-Holland Publishing Company. Amsterdam, NL, vol. 106, No. 1, Dec. 1995, pp. 68-73, XP004001787 ISSN: 0168-583X—the whole document.
Anonymous: “Improved metal/polymer adhesion durability by ion beam modification” Research Disclosure, Kenneth Mason Publications, Westbourne, GB, vol. 339, No. 42, Jul. 1992 XP007117903 ISSN: 0374-4353 the whole document.
Chin-An Chang,J.E.E. Baglin,A.G.Schrott ,K.C.Lin: “Enhanced Cu-Teflon adhesion by presputtering prior to the Cu deposition” Applied Physics Letters, vol. 51,No. 2,Jul. 13, 1987, pp. 103-105, XP002332106 p. 103, left-hand column, line F-p. 105, right-hand column, last line ; figures.
Baglin J E E: “Interface Tailoring for Adhesion Using Ion Beams” Nuclear Instruments & Methods in Physicsresearch, Section-B: Beam InteractionsWith Materials and Atoms, North-Hollandpublishing Company. Amsterdam, NL,vol. B39, No. 1-4 Index, Mar. 2, 1989, pp. 764-768, XP000111163 ISSN: O168-583X abstract; figures figures, the whole document.
Perry C C et al: “Reactivity of Cu with poly (tetrafluoroethylene) and poly(vinyl chloride): Effect of pre- and post-metallization modification on the metal/polymer interface” Journal of Vacuum Science and Technology A. Vacuum, Surfaces and Films, American Institute of Physics, New York, NY, US, vol. 20,No. 5, Sep. 2002, pp. 1690-1698, XP012006183 ISSN:0734-2101 p. 1693, left-hand column, paragraph 2-p. 1694, left-hand column, paragraph 1; figures * B. Reactivity of Copper on PTFE*.
Bertrand P. et al: “Polymer metallization: Low energy ion beam surface modification to improve adhesion” Nuclear Instruments & Methods in Physics Research, Section-B: Beam InteractionsWith Materials and Atoms, North-Hollandpublishing Company. Amsterdam, NL, vol. 131, No. 1-4, Aug. 1997, pp. 71-78, XP004100503 ISSN: 0168-583X the whole document.
N.Capps, L. Lou, M. Amann: “Application Note: Ion Source Applications: Polymer Surface Modification” ′Online!2000, XP002332107 Retrieved from the Internet: URL: http://www.advanced-energy.com/upload/ app—4a—3.pdf> retrieved on Jun. 15, 2005! Advanced Energy Industries, Inc. the whole document.

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