Protective tape applying method and apparatus, and...

Details Protective tape applying method and apparatus, and... Protective tape applying method and apparatus, and...

2005-07-19

2005-07-19

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S459000, C438S464000, C438S689000, C438S692000

Reexamination Certificate

active

06919284

ABSTRACT:
A protective tape is applied to a surface of a wafer supported by a chuck table. A blade tip of a cutter unit is inserted into a groove formed in the chuck table circumferentially of the wafer, to cut the protective tape to have a larger diameter than the wafer. The wafer with the protective tape applied thereto undergoes a back grinding process. Subsequently, in a separating step, the protective tape is separated by means of a separating tape applied to the surface of protective tape.

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