Protective layers compatible with thick film pastes

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Reexamination Certificate

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C430S273100, C430S311000, C430S319000

Reexamination Certificate

active

10713606

ABSTRACT:
This invention relates to novel processes comprising a protective polymer layer in the fabrication of electronic devices using thick film pastes. The protective polymer layer is fabricated from materials which are insoluble after irradiation in the ester-type solvents contained in the thick film paste. By appropriate selection of protective film polymers, the protective film can be compatible with the thick film paste.

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