Protective layer during scribing

Details Protective layer during scribing Protective layer during scribing

2007-09-04

2007-09-04

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S033000, C438S068000, C438S113000, C438S114000, C438S458000, C438S462000, C438S465000, C257S620000

Reexamination Certificate

active

10676303

ABSTRACT:
A method including forming a chemically soluble coating on a plurality exposed contacts on a surface of a circuit substrate; scribing the surface of the substrate along scribe areas; and after scribing, removing a portion of the coating. A method including forming a circuit structure comprises a plurality of exposed contacts on a surface, a location of the exposed contacts defined by a plurality of scribe streets; forming a coating comprising a chemically soluble material on the exposed contacts; scribing the surface of the substrate along the scribe streets; and after scribing, removing the coating. A method including coating a surface of a circuit substrate comprising a plurality of exposed contacts with a chemically soluble material; scribing the surface of the substrate along scribe areas; removing the coating; and sawing the substrate in the scribe areas.

REFERENCES:
patent: 3615951 (1971-10-01), Franco et al.
patent: 4842662 (1989-06-01), Jacobi
patent: 5286343 (1994-02-01), Hui
patent: 5543365 (1996-08-01), Wills et al.
patent: 5597767 (1997-01-01), Mignardi et al.
patent: 5641416 (1997-06-01), Chadha
patent: 6465329 (2002-10-01), Glenn
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6777250 (2004-08-01), Nakajyo et al.
patent: 6838299 (2005-01-01), Mulligan et al.
patent: 2002/0031899 (2002-03-01), Manor
patent: 2003/0013233 (2003-01-01), Shibata
patent: 2004/0014253 (2004-01-01), Gupta et al.
patent: 2004/0110010 (2004-06-01), Buchwalter et al.
patent: 2004/0112880 (2004-06-01), Sekiya
patent: 2004/0121514 (2004-06-01), Yoo et al.
patent: 2004/0188400 (2004-09-01), Peng et al.
patent: 0818818 (1998-01-01), None
patent: 04067650 (1992-03-01), None
patent: 05211381 (1993-08-01), None
patent: 2000-630747 (2000-08-01), None
patent: 2002055219 (2000-08-01), None
H.S. Lehman, et al., “Insulating Lateral Surfaces on Semiconductor Chips,” IBM Technical Disclosure Bulletin, vol. 7, No. 12, May 1965, 2 pages.

Affiliated with

Also associated with

Rating

Protective layer during scribing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Protective layer during scribing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Protective layer during scribing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3769907