Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1997-10-31
2000-06-06
Sergent, Rabon
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 11, 134 3, 134 221, 134 37, 216 2, 216 37, 216 74, 216 79, 216 99, B08B 308, B08B 500, C25F 302, C25F 312
Patent
active
060713534
ABSTRACT:
The present invention is a method for cleaning a process chamber without damaging the process kit by coating the process kit with another consumable material that protects the process kit during the etch that removes buildup from the processing chamber. First, a polysilicon layer is deposited on at least one inner surface of the processing chamber. Next, a silicon nitride layer deposition is performed on at least one semiconductor substrate in the processing chamber. The semiconductor substrate having said nitride layer thereon is then removed from the processing chamber. An etch is then performed to remove the nitride layer buildup from the inner surface of the processing chamber that has the polysilicon layer thereon.
REFERENCES:
patent: 4867841 (1989-09-01), Loewenstein et al.
patent: 5565038 (1996-10-01), Ashley
patent: 5849092 (1998-12-01), Xi et al.
patent: 5868852 (1999-02-01), Johnson et al.
patent: 5926743 (1999-07-01), Xi et al.
Applied Materials Inc.
Sergent Rabon
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