Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-06-14
2005-06-14
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S780000, C438S781000
Reexamination Certificate
active
06905958
ABSTRACT:
A structure and method for protecting exposed copper lines with chemisorbed, sacrificial, organic monolayers from further processing steps are herein described.
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Laibinis, Paul E., et al., “Comparison of the Structures and Wetting Properties of Self-Assembled Monolayers of n-Alkanethiols on the Coinage Metal Surfaces, Cu, Ag, Au,” Journal of the American Chemical Society, vol. 113, No. 19; Sep. 11, 1991, pp. 7152-7167.
Laibinis, Paul E., et al., “Self-Assembled Monolayers of n-Alkanethiolates on Copper are Barrier Films That Protect the Metal Against Oxidation by Air,” Journal of the American Chemical Society, vol. 114, 1992, pp. 9022-9028.
Gracias David H.
Kloster Grant
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Perkins Pamela E
Trinh Michael
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