Protecting copper dielectric interface from delamination

Details Protecting copper dielectric interface from delamination Protecting copper dielectric interface from delamination

1997-02-28

1998-06-30

Lusignan, Michael

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

427 98, 427327, 428413, 428901, B32B 300

Patent

active

057731322

ABSTRACT:
A method of minimizing forming of white spots and delamination of a copper plane bonded to one surface of a dielectric material following additive pattern plating of copper onto the other surface of the material and in vias contacting the copper plane utilizing a plating solution containing a reducing agent and the resulting product is provided. The surface of the copper which has been bonded to the one surface of the dielectric has been treated, preferably by a sodium chlorite treatment to form a chemical roughened surface of copper oxide (CuO and CuO(II)) on the copper. Prior to the bonding, the roughened surface of the copper oxide is treated with a solution such as benzotriazole, which complexes with the copper oxide to prevent formation of white spots and delamination as a result of such plating.

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