Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Physical design processing
Reexamination Certificate
2011-04-19
2011-04-19
Le, Don P (Department: 2819)
Computer-aided design and analysis of circuits and semiconductor
Integrated circuit design processing
Physical design processing
C326S038000
Reexamination Certificate
active
07930664
ABSTRACT:
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
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Feng Kai Di
Hsu Louis Lu-Chen
Wang Ping-Chuan
Yang Zhijian
Brown Katherine S.
International Business Machines - Corporation
Le Don P
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