Profiled substrate heating

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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Details

219411, 392418, 118725, 417557, H01L 2126

Patent

active

056500823

ABSTRACT:
An apparatus and method for thermal processing, and more particularly for rapid thermal processing wherein a first thermal radiator generates and projects a first pattern of thermal radiation onto a first surface of a substrate, and wherein a second thermal radiator generates and projects a second pattern of thermal radiation onto a second surface of the substrate. The temperatures on the first and second surfaces are sensed by sensing means. Means for controlling the first and second thermal radiator means in response to the sensing means cause a prescribed temperature profile to be produced within the substrate.

REFERENCES:
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patent: 4886954 (1989-12-01), Yu et al.
patent: 4924073 (1990-05-01), Chiba
patent: 5108792 (1992-04-01), Anderson et al.
patent: 5154512 (1992-10-01), Schietinger et al.
patent: 5179677 (1993-01-01), Anderson et al.
patent: 5418885 (1995-05-01), Hauser et al.

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