Production process for semiconductor apparatus

Details Production process for semiconductor apparatus Production process for semiconductor apparatus

2005-04-19

2005-04-19

Pert, Evan (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C438S692000

Reexamination Certificate

active

06881656

ABSTRACT:
A production process for a semiconductor apparatus is provided in which there is no danger of particle generation, and consequently no danger of associated problems resulting from the presence of particles, such as shorting, and which as a result, is capable of producing improved product yields, good product quality stability and improved product reliability.A resist13bis formed on those regions of a N-type silicon substrate1on which wiring is not to be formed, a conductive layer15is formed across the entire surface of the N-type silicon substrate1including the resist13b, and the conductive layer15is then polished by mechanical polishing, as this result, the surface of the resist13bis exposed.

REFERENCES:
patent: 5679610 (1997-10-01), Matsuda et al.
patent: 20040106295 (2004-06-01), Cyrille et al.

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