Production of solder masked electric circuit boards

Details Production of solder masked electric circuit boards Production of solder masked electric circuit boards

1991-10-08

1993-01-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156655, 1566591, 156660, 156901, 156904, 205188, B44C 122, B29C 3700

Patent

active

051819848

ABSTRACT:
The present invention provides a process for forming a solder mask on an electric circuit board without any defects. The process comprises forming an electric circuit on a substrate, coating a negative type photosensitive solder resist on the obtained electric circuit board, and then exposing to light through a negative film followed by developing, characterized in that the negative type photosensitive solder resist is electrodepositable and said coating of the solder resist is conducted by electrocoating the resist on an electroconductive transfer substrate which is different from the electric circuit board and then transferring the coated film onto the electric circuit board.

REFERENCES:
patent: 4746399 (1988-05-01), Demmer et al.
patent: 4861438 (1989-08-01), Banks et al.
patent: 4983252 (1991-01-01), Masui et al.
patent: 5102519 (1992-04-01), Matuyama et al.

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