Production of a polymer/metal or polymer/semiconductor composite

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156633, 156634, 156643, 156645, B32B 3100

Patent

active

053565118

ABSTRACT:
A process for producing a polymer/metal or polymer/semiconductor composite having an adhesive layer between the polymer and the metal or between the polymer and the semiconductor in which a layer of at least two different chemical elements is applied to the metal or semiconductor by vapor-deposition or cathode sputtering, then selectively or partially removing at least one chemical element of this layer in an etching process, and then applying the polymer.

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