Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-27
2010-06-01
Le, Thao X (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21527
Reexamination Certificate
active
07727873
ABSTRACT:
An object of the present invention is to provide a method for producing a gallium nitride-based compound semiconductor multilayer structure useful for the production of a gallium nitride-based compound semiconductor light-emitting device which can ensure that the operating voltage is reduced, the light emission output is good and the light emission output is less changed due to aging.The inventive production method of a gallium nitride-based compound semiconductor multilayer structure comprises a substrate having thereon an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, the light-emitting layer being disposed between the n-type semiconductor layer and the p-type semiconductor layer, and the light-emitting layer having a multiple quantum well structure formed by alternately stacking a well layer and a barrier layer, wherein at least one well layer has a non-uniform thickness, at least a part of the barrier layer is grown at a higher temperature than the well layer, and the temperature difference between each growth temperature of the well layer, the barrier layer and the p-type semiconductor layer is adjusted to be in a specific range.
REFERENCES:
patent: 2002/0004252 (2002-01-01), Watanabe et al.
patent: 2003/0160229 (2003-08-01), Narayan et al.
patent: 3660446 (2005-03-01), None
Sato Hisao
Takeda Hitoshi
Le Thao X
Showa Denko K.K.
Sughrue & Mion, PLLC
Ullah Elias
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