Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2005-02-08
2005-02-08
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S460000, C438S461000, C438S462000, C438S463000, C438S977000
Reexamination Certificate
active
06852608
ABSTRACT:
A semiconductor wafer is applied to a support disk via an intervening adhesive layer with the front side of the semiconductor wafer facing the adhesive layer, which is sensitive to a certain exterior factor for reducing its adhesive force; the semiconductor wafer is ground on the rear side; the wafer-and-support combination is applied to a dicing adhesive tape with the so ground rear side facing the dicing adhesive tape, which is surrounded and supported by the circumference by a dicing frame; the certain exterior factor is effected on the intervening adhesive layer to reduce its adhesive force; and the intervening adhesive layer and support disk are removed from the semiconductor wafer or chips without the possibility of damaging the same.
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Kimura Yusuke
Kitamura Masahiko
Tabuchi Tomotaka
Yajima Koichi
Berezny Nema
Disco Corporation
Jr. Carl Whitehead
Wenderoth , Lind & Ponack, L.L.P.
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