Production method for making film carrier tape for mounting...

Details Production method for making film carrier tape for mounting... Production method for making film carrier tape for mounting...

2006-07-04

2006-07-04

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C205S125000

Reexamination Certificate

active

07071026

ABSTRACT:
A film carrier tape for mounting electronic devices thereon has a tin-bismuth alloy deposit in which the bismuth content in the deposit is substantially uniform along a thickness direction thereof. The film carrier tape can be produced by plating at least a part of a wiring pattern with a tin-bismuth alloy and washing the tin-bismuth alloy deposit formed by plating with a water-ejecting washing nozzle within 6 seconds after the plating is completed. A plating apparatus for use in the above production includes a washing nozzle for washing the film carrier tape within 6 seconds after the film carrier tape has exited a plating tank.

REFERENCES:
patent: 4322280 (1982-03-01), Houska et al.
patent: 5039576 (1991-08-01), Wilson
patent: 5308464 (1994-05-01), Murphy et al.
patent: 2003/0224111 (2003-12-01), Suganuma et al.
patent: 62-007891 (1987-01-01), None
patent: 04-080398 (1992-03-01), None
patent: 2002-246425 (2002-08-01), None
patent: 2002-317296 (2002-10-01), None

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