Producing viaholes in plastic sheets and application of the meth

Details Producing viaholes in plastic sheets and application of the meth Producing viaholes in plastic sheets and application of the meth

1987-08-18

1989-05-30

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156646, 1566591, 156668, 156902, 20419232, 20419236, 29852, C23F 102

Patent

active

048348350

ABSTRACT:
Viaholes are dry-etched into glass fiber reinforced plastic sheets according to a predetermined hole pattern, leaving the glass fiber meshing practically unaffected.
The method is used, for instance, to fabricate plastic sheets with unilaterally or bilaterally applied conductor patterns and viaconnectors that are conductively linked to the conductor patterns, and to fabricate multilayer board laminates obtained by several plastic sheets carrying the conductor pattern being alternately packaged, if required, with untreated copper sheets, and by the package thus obtained being subsequently laminated. Such boards and/or plastic sheets bilaterally provided with conductor patterns may be used as connector boards for, say, multilayer ceramic modules carrying semiconductor chips.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3778900 (1973-12-01), Haining et al.
patent: 4012307 (1977-03-01), Phillips
patent: 4247600 (1981-01-01), Adachi
patent: 4367119 (1983-01-01), Logan et al.
patent: 4447824 (1984-05-01), Logan et al.
patent: 4597828 (1986-07-01), Tadros
Yeh, J. T. C., et al., "Magnetic field enhanced reactive ion etching of polyimide", J. Vac. Sci. Technol. A 2 (3), pp. 1292-1295, Jul.-Sep. 1984.
Eggitto, F. D., et al., Plasma etching of organic materials, I, Polyimide in 02-CF4, J. Vac. Sci. Technol. B3 (3), pp. 893-904, May/Jun. 1985.
Turban, G. and Rapequx, M., "Dry Etching of Polyimide in 02-CF4 and 02-SF4 Plasmas", J. Electrochem. Soc.: Solid-State Schience and Technology, pp. 2231-2236, Nov. 1983.
Ting, C. H., et al., Semiconductor International, Feb. 1985.
Abstract No. 179 from 1046 Extended Abstracts, T. O. Herndon, W. J. Landoch, & R. O. Burke, entitled "Plasma Etching of Vias in Polyimide Using Nonerodible Masks", vol. 83-1, May 1983, p. 290, Pennington, NJ, USA.
Abstract of "Reaction Kinetic Processes at the Interface Between Nonisothermal Plasma and Solid", J. Freidrich, p. 397 of Catalysis, Kinetics, vol. 95, 1981, Berlin, Ger. Dem. Rep.

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