Producing viaholes in plastic sheets and application of the meth

Details Producing viaholes in plastic sheets and application of the meth Producing viaholes in plastic sheets and application of the meth

1985-06-10

1991-06-11

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

65 23, 156644, 156656, C03C 2506, H05K 300, H05H 100

Patent

active

050229567

ABSTRACT:
Viaholes are dry-etched into glass fiber reinforced plastic sheets according to a predetermined hole pattern, leaving the glass fiber meshing practically unaffected.
The method is used, for instance, to fabricate plastic sheets with unilaterally or bilaterally applied conductor patterns and viaconnectors that are conductively linked to the conductor patterns, and to fabricate multilayer board laminates obtained by several plastic sheets carrying the conductor pattern being alternately packaged, if required, with untreated copper sheets, and by the package thus obtained being subsequently laminated. Such boards and/or plastic sheets bilaterally provided with conductor patterns may be used as connector boards for, say, multilayer ceramic modules carrying semiconductor chips.

REFERENCES:
patent: 3099608 (1963-07-01), Radousky et al.
patent: 3778900 (1973-12-01), Haining et al.
patent: 4012307 (1977-03-01), Phillips
patent: 4247600 (1981-01-01), Adachi
patent: 4367119 (1983-01-01), Logan et al.
patent: 4447824 (1984-05-01), Logan et al.
patent: 4597828 (1986-07-01), Tadros
"Plasma Etching of Viasin Polyimide Using Nonerodible Masks", by Landoch et al, 1046B Extended Abstracts vol. 83-1, 5/83. p. 240, No. 79.
"Reaction Knetic Processes at the Interface Between Nonisothermal Plasma and Solid" by J. Freidrich, Kinetics of Catalysts, vol. 95, 1981, p. 397.

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