Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2008-07-08
2008-07-08
Huff, Mark F. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S319000, C430S320000
Reexamination Certificate
active
07396635
ABSTRACT:
A producing method of a wired circuit board that can prevent meandering of the elongate base material conveyed with the rolls and also prevent entry of air bubbles in between a light-transparency protecting film and a photosensitive solder resist layer when the light-transparency protecting film is laminated on the photosensitive solder resist layer. After a conductive pattern3is formed on the front side of the elongate base material1by the additive process, a narrow stiffener sheet7smaller in width than the elongate base material1is provided on the back side of the elongate base material1. Then, after the photosensitive solder resist layer10is formed on the front side of the elongate base material1to cover the conductive pattern3, the light-transparency protecting film11is laminated on the front side of the photosensitive solder resist layer10. Thereafter, the photosensitive solder resist layer10is exposed to light through the light-transparency protecting film11. Then, after the light-transparency protecting film11is stripped off from the photosensitive solder resist layer10, the photosensitive solder resist layer10was developed and then cured by heating. Thereafter, the narrow stiffener sheet7is stripped off from the elongate base material. The flexible wired circuit board is produced in the manner described above.
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Akerman & Senterfitt
Edwards, Esq. Jean C.
Huff Mark F.
Nitto Denko Corporation
Sullivan Caleen O
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