Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-03-23
1993-05-18
Beck, Shrive
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
427 96, 427305, 427306, 427307, 427551, 427554, C23C 2600
Patent
active
052118037
ABSTRACT:
Poly(arylene sulfide) articles having plated metal paths thereon are disclosed. A pattern of areas of lesser crystallinity and areas of higher crystallinity is created in the polymer morphology of a surface of the article. The surface is then exposed to a chemical etchant selectively active upon the areas of lesser crystallinity thereby etching those areas of lesser crystallinity while leaving areas of higher crystallinity substantially unaffected. Then a conductive metal is deposited on the etched areas of lesser crystallinity by an electroless plating process. Subsequent electroplating can also be used.
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Exhibit A-GTE Profile, Mar./Jun., 1963.
Exhibit B-C&EN, Sep. 10, 1984, p. 37, article entitled "Process Makes Flexible Printed Circuit Boards".
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Johnson Timothy W.
Stone Mark L.
Beck Shrive
Dang Vi Duong
Phillips Petroleum Company
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