Producing a substrate having high surface-area texturing

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S275100, C430S302000, C430S322000, C430S323000, C430S396000, C430S945000, C216S065000, C216S067000, C216S075000, C216S079000

Reexamination Certificate

active

11092540

ABSTRACT:
A method is provided for preparing high surface-area texturing of a substrate using methods by which material from a substrate is subtracted from or added to the surface of the substrate. In one embodiment, the method is a subtractive lithographic method that involves exposing a laser-ablatable substrate, such as a polymeric or ceramic substrate, to laser light. A mask may be used to define the pattern of light incident on the substrate. High surface-area textured substrates, in particular, miniaturized planar analysis devices having high surface-area textured features, prepared by the methods disclosed herein, are also provided. A method by which the high surface-area textured substrate or the miniaturized planar analysis device is used as a master from which replicate copies thereof may be made is also provided.

REFERENCES:
patent: 4032861 (1977-06-01), Rothrock
patent: 4478677 (1984-10-01), Chen et al.
patent: 4490210 (1984-12-01), Chen et al.
patent: 4490211 (1984-12-01), Chen et al.
patent: 4923772 (1990-05-01), Kirch et al.
patent: 5005872 (1991-04-01), Lass et al.
patent: 5322988 (1994-06-01), Russell et al.
patent: 5500071 (1996-03-01), Kaltenbach et al.
patent: 5571410 (1996-11-01), Swedberg et al.
patent: 5635089 (1997-06-01), Singh
patent: 5658413 (1997-08-01), Kaltenbach et al.
patent: 5882827 (1999-03-01), Nakao
patent: 5968595 (1999-10-01), Kutscher
patent: 6285443 (2001-09-01), Wangler et al.
patent: 7-80675 (1995-03-01), None
patent: 7-241690 (1995-09-01), None
Krajnovich et al., “Formation of ‘Intrinsic’ Surface Defects During 248 mn Photoblation of Polyimide,”J. Appl Phys. 73: 3001-3008 (1993).
Becker et al. (1998), “Planar Quartz Chips with Submicron Channels for Two-Dimensional Capillary Electrophoresis Applications,”J. Micromech. Microeng. 8:24-28.
He et al. (1998), “Fabrication of Nanocolumns for Liquid Chromatography,”Anal. Chem. 70(18): 3790-3797.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Producing a substrate having high surface-area texturing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Producing a substrate having high surface-area texturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Producing a substrate having high surface-area texturing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3938874

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.