Processing system and method for treating a substrate

Details Processing system and method for treating a substrate Processing system and method for treating a substrate

2006-04-18

2006-04-18

Schillinger, Laura M. (Department: 2813)

Coating apparatus

Gas or vapor deposition

C216S059000, C216S079000

Reexamination Certificate

active

07029536

ABSTRACT:
A processing system and method for chemical oxide removal (COR), wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

REFERENCES:
patent: 4492610 (1985-01-01), Okano et al.
patent: 4838978 (1989-06-01), Sekine et al.
patent: 5240556 (1993-08-01), Ishikawa et al.
patent: 5273588 (1993-12-01), Foster et al.
patent: 5282925 (1994-02-01), Jeng et al.
patent: 5769952 (1998-06-01), Komino
patent: 5838055 (1998-11-01), Kleinhenz et al.
patent: 5876879 (1999-03-01), Kleinhenz et al.
patent: 6071815 (2000-06-01), Kleinhenz et al.
patent: 6074951 (2000-06-01), Kleinhenz et al.
patent: 6099651 (2000-08-01), Sajoto et al.
patent: 6165271 (2000-12-01), Zhao et al.
patent: 6245619 (2001-06-01), Boyd et al.
patent: 6258170 (2001-07-01), Somekh et al.
patent: 6271094 (2001-08-01), Boyd et al.
patent: 6284006 (2001-09-01), Siefering et al.
patent: 6335261 (2002-01-01), Natzle et al.
patent: 6527865 (2003-03-01), Sajoto et al.
patent: 6951821 (2005-10-01), Hamelin et al.
patent: 2001/0016226 (2001-08-01), Natzle et al.
patent: 2002/0002947 (2002-01-01), Satoyoshi et al.
patent: 2002/0011216 (2002-01-01), Nguyen
patent: 2002/0015855 (2002-02-01), Sajoto et al.
patent: 2002/0028555 (2002-03-01), Boyd et al.
patent: 2002/0056417 (2002-05-01), Yonemizu et al.
patent: 2002/0063110 (2002-05-01), Cantell et al.
patent: 2002/0189757 (2002-12-01), Denton et al.
patent: 2002/0195201 (2002-12-01), Beer et al.
patent: 2004/0020601 (2004-02-01), Zhao et al.
patent: 2004/0182315 (2004-09-01), Laflamme et al.
patent: 2004/0182417 (2004-09-01), Hamelin et al.
patent: 2004/0184792 (2004-09-01), Hamelin et al.
patent: 2004/0185583 (2004-09-01), Tomoyasu et al.
patent: 2004/0185670 (2004-09-01), Hamelin et al.
patent: 2005/0211386 (2005-09-01), Hamelin et al.
patent: 2005/0218113 (2005-10-01), Yue
patent: 2005/0218114 (2005-10-01), Yue et al.
patent: 2005/0227494 (2005-10-01), Higuchi et al.
patent: WO 01/70517 (2001-09-01), None

Affiliated with

Also associated with

Rating

Processing system and method for treating a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processing system and method for treating a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing system and method for treating a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3561299