Processing printed circuit boards

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156345, 156666, 156901, 427 98, C23F 102

Patent

active

040826058

ABSTRACT:
A method and apparatus for etching, developing, or plating circuit boards with a solution utilizing a transparent container in which the circuit board is contacted with the solution.

REFERENCES:
patent: 3182671 (1965-05-01), Voric
patent: 3201238 (1965-08-01), Dwyer
patent: 3954940 (1976-05-01), Rice et al.

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