Electric resistance heating devices – Heating devices – Radiant heater
Reexamination Certificate
2011-07-26
2011-07-26
Campbell, Thor S (Department: 3742)
Electric resistance heating devices
Heating devices
Radiant heater
C392S407000, C392S418000, C702S130000
Reexamination Certificate
active
07986871
ABSTRACT:
A method of adjusting the heat transfer properties within a processing chamber is presented. Chamber properties may be determined and adjusted by adjusting the thermal mass of an edge ring disposed in the processing chamber.
REFERENCES:
patent: 5660472 (1997-08-01), Peuse et al.
patent: 5892236 (1999-04-01), Takahashi et al.
patent: 5937142 (1999-08-01), Moslehi et al.
patent: 6133550 (2000-10-01), Griffiths et al.
patent: 6188044 (2001-02-01), Lee et al.
patent: 6200388 (2001-03-01), Jennings
patent: 6210484 (2001-04-01), Hathaway
patent: 6214755 (2001-04-01), Otsuki et al.
patent: 6215106 (2001-04-01), Boas et al.
patent: 6261370 (2001-07-01), Otsuki et al.
patent: 6375348 (2002-04-01), Hebb et al.
patent: 6402850 (2002-06-01), Beinglass et al.
patent: 6406179 (2002-06-01), Adams et al.
patent: 6466426 (2002-10-01), Mok et al.
patent: 6534752 (2003-03-01), Camm et al.
patent: 6570134 (2003-05-01), Suzuki et al.
patent: 6723202 (2004-04-01), Nagaiwa et al.
patent: 6853802 (2005-02-01), Neyret et al.
patent: 6868302 (2005-03-01), Kobayashi et al.
patent: 7024105 (2006-04-01), Fodor et al.
patent: 7127367 (2006-10-01), Ramachandran et al.
patent: 2003/0000647 (2003-01-01), Yudovsky et al.
patent: 2003/0015141 (2003-01-01), Takagi
patent: 05-114570 (1993-05-01), None
patent: WO-91/10873 (1991-07-01), None
Korean Notice to File a Response dated Mar. 18, 2010 for Korean Patent Application No. 10-2008-0046588.
Office Action dated Sep. 3, 2009 for U.S. Appl. No. 11/751,027.
Office Action dated Jan. 19, 2011 for U.S. Appl. No. 11/751,027.
Hegedus Andreas G.
Ramamurthy Sundar
Thakur Randhir
Applied Materials Inc.
Campbell Thor S
Patterson & Sheridan L.L.P.
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