Processing method using a focused ion beam

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156643, 156657, 156662, 156345, 204192E, 204298, 2504922, 2504923, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

044578032

ABSTRACT:
A processing method using a focused ion beam is proposed which uses a focused ion beam radiation apparatus. When a specimen is irradiated with the focused ion beam in order to be etched, the desired etching depth of the specimen is preset as a function of a location. The ion dose of the focused ion beam, the acceleration voltage, or the etching time may be varied in accordance with the preset data.

REFERENCES:
patent: 3563809 (1971-02-01), Wilson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Processing method using a focused ion beam does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processing method using a focused ion beam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing method using a focused ion beam will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1629547

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.