Processing compositions and methods of using same

Details Processing compositions and methods of using same Processing compositions and methods of using same

1997-08-19

2000-02-29

Gulakowski, Randy

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

510499, 510504, 510175, 216 79, H01L 21306, C11D 904, C11D 900, B44C 122

Patent

active

06030491&

ABSTRACT:
Compositions and methods for processing (e.g., cleaning) substrates, such as semiconductor-based substrates, as well as processing equipment, include one or more compounds of Formula (I): ##STR1## wherein each R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is independently H or an organic group.

REFERENCES:
patent: 2857331 (1958-10-01), Hollingsworth et al.
patent: 4544446 (1985-10-01), Cady
Akiya et al., "Thin-Oxide Dielectric Strength Improvement by Adding a Phosphonic Acid Chelating Agent into NH.sub.4 OH--H.sub.2 O.sub.2 Solution", J. Electrochem. Soc., 141, 4 pgs. (1994).
Cady et al., "RCA Clean Replacement", J. Electrochem. Soc., 143, pp. 2064-2067 (1996).
Hidber et al., "Citric--A Dispersant for Aqueous Alumina Suspensions", J. Am. Ceram. Soc., 79, 1857-1867 (1996).

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