Processing apparatus to be sealed against workpiece

Details Processing apparatus to be sealed against workpiece Processing apparatus to be sealed against workpiece

2005-03-22

2005-03-22

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C118S720000, C451S039000

Reexamination Certificate

active

06869890

ABSTRACT:
A processing apparatus is used for processing a workpiece such as a semiconductor wafer. The processing apparatus comprises a cover for covering a portion of a surface, to be processed, of a workpiece, a process chamber formed by the cover and the surface, to be processed, of the workpiece, and a sealing portion provided between the cover and the surface of the workpiece for sealing the process chamber.

REFERENCES:
patent: 5997963 (1999-12-01), Davison et al.
patent: 6156625 (2000-12-01), Balamurugan
patent: 6187134 (2001-02-01), Chow et al.
patent: 6764386 (2004-07-01), Uziel
patent: 20020042246 (2002-04-01), Togawa et al.

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