Processing apparatus and method

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mechanically forming pattern into a resist

Reexamination Certificate

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C216S041000, C216S048000

Reexamination Certificate

active

07846346

ABSTRACT:
A processing method for transferring a relief pattern of a mold to a resist includes the steps of compressing the mold having the relief pattern against the resist on a substrate, irradiating an exposure light onto the resist through the mold, vibrating the mold and the substrate relative to each other during the irradiating step, and releasing the mold from the resist.

REFERENCES:
patent: 5266136 (1993-11-01), Kanome et al.
patent: 6069931 (2000-05-01), Miyachi et al.
patent: 6284345 (2001-09-01), Ruoff
patent: 6804323 (2004-10-01), Moriya et al.
patent: 2005/0266693 (2005-12-01), Maekawa
patent: 2005/0282402 (2005-12-01), Kim
patent: 2003-7597 (2003-01-01), None
patent: 3450631 (2003-07-01), None
patent: 2004-288811 (2004-10-01), None
Colburn et al., “Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning” , Texas Materials Institute, The University of Texas, Austin, TX, Proceedings of the SPIE 24thInternational Symposium on Microlithography: Emerging Lithographic Technologies III, Santa Clara, CA, vol. 3676, Part One, pp. 379-389, Mar. 1999.

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