Processes for reconditioning multi-component electrodes

Details Processes for reconditioning multi-component electrodes Processes for reconditioning multi-component electrodes

2008-06-30

2011-12-13

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S002000, C134S003000, C438S004000

Reexamination Certificate

active

08075701

ABSTRACT:
A process for reconditioning a multi-component electrode comprising a silicon electrode bonded to an electrically conductive backing plate is provided. The process comprises: (i) removing metal ions from the multi-component electrode by soaking the multi-component electrode in a substantially alcohol-free DSP solution comprising sulfuric acid, hydrogen peroxide, and water and rinsing the multi-component electrode with de-ionized water; (ii) polishing one or more surfaces of the multi-component electrode following removal of metal ions there from; and (iii) removing contaminants from silicon surfaces of the multi-component electrode by treating the polished multi-component electrode with a mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water and by rinsing the treated multi-component electrode with de-ionized water. Additional embodiments of broader and narrower scope are contemplated.

REFERENCES:
patent: 5225034 (1993-07-01), Yu et al.
patent: 5355048 (1994-10-01), Estes
patent: 6073577 (2000-06-01), Lilleland et al.
patent: 6148765 (2000-11-01), Lilleland et al.
patent: 6194322 (2001-02-01), Lilleland et al.
patent: 6245192 (2001-06-01), Dhindsa et al.
patent: 6376385 (2002-04-01), Lilleland et al.
patent: 6506254 (2003-01-01), Bosch et al.
patent: 6776873 (2004-08-01), Sun et al.
patent: 6810887 (2004-11-01), Tan
patent: 7247579 (2007-07-01), Ren et al.
patent: 2003/0104703 (2003-06-01), Yang et al.
patent: 2003/0190870 (2003-10-01), Shih et al.
patent: 2005/0133160 (2005-06-01), Kennedy et al.
patent: 2005/0241765 (2005-11-01), Dhindsa et al.
patent: 2006/0046379 (2006-03-01), Symanczyk et al.
patent: 2006/0138081 (2006-06-01), Huang et al.
patent: 2006/0141787 (2006-06-01), Ren et al.
patent: 2006/0141802 (2006-06-01), Shih et al.
patent: 2007/0059645 (2007-03-01), Tang et al.
patent: 2007/0068629 (2007-03-01), Shih et al.
patent: 2007/0235660 (2007-10-01), Hudson
patent: 2007/0284246 (2007-12-01), Keil et al.
patent: 2008/0015132 (2008-01-01), Ren et al.
patent: 2008/0092920 (2008-04-01), Shih et al.
patent: 2008/0099054 (2008-05-01), Rabinovich et al.
patent: 2008/0236618 (2008-10-01), Outka et al.
patent: 2008/0236620 (2008-10-01), Shih et al.
patent: 2010/0108093 (2010-05-01), Peng et al.
patent: 2010/0139692 (2010-06-01), Avoyan et al.
patent: 7066180 (1995-03-01), None
patent: 2001176846 (2001-06-01), None
International Search Report and Written Opinion dated Feb. 11, 2010 pertaining to International application No. PCT/US2009/048244.

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