Processes for forming resist pattern and for producing semicondu

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430313, 430318, 430319, 4302721, 4302861, 216 67, 438197, 438585, 438725, G03C 500

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059069120

ABSTRACT:
An electroconductive pattern is formed by coating a substrate with a solution comprising 100 parts by weight of a soluble electroconductive polymer containing an organic radical capable of cross-linking with a cross-linking agent, 5 to 1,000 parts by weight of a cross-linking agent, and 100 to 100,000 parts by weight of a solvent; effecting cross-linking of the resultant coated film to obtain a cured electroconductive film having a sheet resistance of 10.sup.10 .OMEGA./.quadrature. or less; forming a pattern as an upper layer on the cured electroconductive layer; and transferring the pattern of the upper layer to the cured electroconductive layer.

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patent: 5612241 (1997-03-01), Arima
patent: 5776659 (1998-07-01), Watanabe et al.
J. Appl. Phys., vol. 44, No. 9, Sep. 1973, (Fundamental Aspects of Electron Beam Lithography. 1. Depth-dose Response of Polymeric Electron Beam Resists) by R. D. Heidenreich, et al.
J. Vac. Sci. Technol.B 8(6), Nov./Dec. 1990, (Resist Heating Effects in 25 and 50 kV e-beam Lithography on Glass Masks) by E. Kratschmer, et al.
J. Vac. Sci. Technol.B 10(6), Nov./Dec. 1992, (Fast Proximity Effect Correction Method using a Pattern area Density Map) by Fumio Murai, et al.

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