Processes for electrically conductive decals filled with organic

Details Processes for electrically conductive decals filled with organic Processes for electrically conductive decals filled with organic

1991-03-06

1992-05-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156652, 156656, 1566591, 1566611, 156901, B44C 122, C23F 102, B29C 3700

Patent

active

051164590

ABSTRACT:
The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.

REFERENCES:
patent: 2692190 (1954-10-01), Pritikin
patent: 3181986 (1965-05-01), Pritikin
patent: 3541222 (1970-11-01), Parks et al.
patent: 3683105 (1972-08-01), Shamash et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4606787 (1986-08-01), Pelligrono et al.
patent: 4707657 (1987-11-01), Boegh-Peterson
patent: 4753694 (1988-06-01), Herron et al.
patent: 4879156 (1989-11-01), Herron et al.
patent: 4926549 (1990-05-01), Yoshizawa et al.
G. Kraus, et al., "Process for Transferring Thin-Film Conductor Patterns to a Multilayer Ceramic Substrate for Semiconductor Chips", IBM Technical Disclosure Bulletin, vol. 27, No, 3, pp. 1404-1405 (Aug. 1984).

Affiliated with

Also associated with

Rating

Processes for electrically conductive decals filled with organic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Processes for electrically conductive decals filled with organic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processes for electrically conductive decals filled with organic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-417170