Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-03-06
1992-04-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156652, 156656, 1566611, 156901, B44C 122, C23F 102, B29C 3700
Patent
active
051085410
ABSTRACT:
The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.
REFERENCES:
patent: 2692190 (1954-10-01), Pritikin
patent: 3181986 (1965-05-01), Pritikin
patent: 3541222 (1970-11-01), Parks et al.
patent: 3683105 (1972-08-01), Shamash et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4606787 (1986-08-01), Pelligrino et al.
patent: 4707657 (1987-11-01), Boegh-Peterson
patent: 4753694 (1988-06-01), Herron et al.
patent: 4879156 (1989-11-01), Herron et al.
patent: 4926549 (1990-05-01), Yoshizawa et al.
G. Kraus et al., "Process for Transferring Thin-Film Conductor Patterns to a Multilayer Ceramic Substrate for Semiconductor Chips," IBM Technical Disclosure Bulletin, vol. 27, No. 3, pp. 1404-1405 (Aug., 1984).
Acocella John
Herron Lester W.
Kordus Mark R.
Schneider Mark S.
Wirtz Louis H.
Ahsan Aziz M.
International Business Machines Corp.
Powell William A.
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