Processes depending on plasma discharges sustained in a helical

Details Processes depending on plasma discharges sustained in a helical Processes depending on plasma discharges sustained in a helical

1991-04-17

1994-04-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 118723E, 427551, H01L 2100

Patent

active

053042824

ABSTRACT:
Plasma etching and deposition is accomplished utilizing a helical resonator constructed with an inner diameter coil greater than 60 percent of the outer shield diameter. The diameter of the conductor used to form the coil is not critical and can be less than 40 percent of the winding pitch in some applications. These parameters permit helical resonator plasma sources to be more compact and economical, and facilitate improved uniformity for processing large substrates.

REFERENCES:
patent: 4033287 (1977-07-01), Alexander et al.
patent: 4310380 (1982-01-01), Flamm et al.
patent: 4368092 (1983-01-01), Steinberg et al.
patent: 4918031 (1990-04-01), Flamm et al.
"Coaxial Resonators with Helical Inner Conductor"; Proceedings of the IRE; .COPYRGT.1958; pp. 2099-2105; Macalpine et al.
"Application of a Ion-Pressure Radio Frequency Discharge Source to Polysilicon Gate Etching"; Cook et al.; J. Vac. Science B 8(1); Feb. 1990; pp. 1-4.
"Silicon Oxide Deposition From Tetraoxysilane in a Radio Frequency Downstream Reactor: Mechanisms and Step Coverage"; Selamoglu et al.; J. Vac. Science B 7(6); Dec. 1989; pp. 1345-1351.

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