Process using plasma for forming conductive through-holes throug

Details Process using plasma for forming conductive through-holes throug Process using plasma for forming conductive through-holes throug

1983-12-05

1984-09-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29853, 156644, 156645, 156646, 156656, 156666, 156668, 156902, 204192E, B44C 122, B29C 1708, C03C 1500, C23F 102

Patent

active

044722389

ABSTRACT:
A conductive through-hole is formed by plasma etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.

REFERENCES:
patent: 3557446 (1971-01-01), Charschan
patent: 3969815 (1976-07-01), Hacke et al.
patent: 4184909 (1980-01-01), Chang et al.
patent: 4240869 (1980-12-01), Diepers
patent: 4277321 (1981-07-01), Bartlett et al.
patent: 4289573 (1981-09-01), Economy et al.
patent: 4319708 (1982-03-01), Lomerson
J. W. Coburn, "Plasma Etching", pp. 1-7.
CPI Prior Art Search Report, J. P. Daniszewski, pp. 2-8.

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