Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymerizing in reactor of specified material – or in reactor...
Patent
1994-06-16
1996-01-16
Schofer, Joseph L.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Polymerizing in reactor of specified material, or in reactor...
526 74, C08F 202, C08F 204, C08F 222, C08F 234
Patent
active
054848563
ABSTRACT:
A polymer scale preventive process for use in polymerization of a monomer having an ethylenically unsaturated double bond, comprising an alkaline solution containing a condensation product of (A) an aromatic amine compound having at least two amino groups and (B) an aromatic tetracarboxylic acid anhydride. This process is used for forming a coating on the inner wall, etc. of a polymerization vessel. Such a vessel is effective in preventing polymer scale deposition and useful in producing a polymer that shows very few fish eyes and good whiteness when formed into sheets or the like.
REFERENCES:
patent: 4081248 (1978-03-01), Cohen
patent: 4418163 (1983-11-01), Murakami et al.
patent: 4904740 (1990-02-01), Blum et al.
patent: 5218055 (1993-06-01), Marrion et al.
"Polyimide and Polyimide-Polyurethane Coatings, and their Solderable Electrically Insulated Wires and Flyback Transformers Therefrom" Jpn. Kokai Tokky Koho, Tajima et al., p. 47.
"Polyimide Membranes for Separating Water from Organic Compound", Maeda et al., Jpn Kokai Tokkyo Koho, p. 5.
"Liquid Crystal Device", Matsuda et al., EPA, p. 44.
Miscible Blends of Isopropylidene-Based Polyimide with Poly(aryl sulfones), Harris et al., EPA, p. 36.
"Synthesis and Characterization of Poly(amide imides)", Dezern et al., Polymer Eng. Sci., 31(12), 860-6.
"Heat-Resistant Polymers", Toko et al., Jpn. Kokai Tokkyo Koho, p. 12.
"Base-Soluble Polyimide Release Layer for Microlithographic Processing", Brewer et al., PCT Appl., p. 53.
"Polyimides End-Capped with Diaryl Substituted Acetylene", Paul et al., U.S. Pat. No. 5,138,028.
"Organic Polymer and Preparation and Use Thereof", Takimoto et al., EPA, p. 82.
"Microstructures of Copper Thin Films Sputtered onto Polyimide", Chung et al., Han'guk Ryomyon Konghak Hoechi, 25(2), 90-6.
"Positive Photoresist Composition Containing Polyimide Precursor", Omote et al., EPA, p. 23.
"New Approach to the Description of Young's Modulus for Highly Oriented Polymers. II. Relationship Between Young's Modulus and Thermal Expansion of Polymers Over a Wide Temperature Range", Bronnikov et al., J. Macromol. Sci., Phys., B32(1), 33-50.
Database Chemical Abstracts, CA88(18), 121 917e, 1978, JP-A-52 108 473, Sep. 10, 1977.
H. F. Mark, et al., "Encyclopedia of Polymer Science & Engineering", vol. 12, ed. 2, pp. 364-368 and 394-395, 1988.
Shimizu Toshihide
Watanabe Mikio
Schofer Joseph L.
Shin-Etsu Chemical Co. , Ltd.
Weber Tom
LandOfFree
Process to prevent scale adhesion using the condensation product does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process to prevent scale adhesion using the condensation product, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process to prevent scale adhesion using the condensation product will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-310048