Process to manufacture bushings for micromechanical elements

Details Process to manufacture bushings for micromechanical elements Process to manufacture bushings for micromechanical elements

1993-06-29

1995-05-23

Fourson, George

Etching a substrate: processes

Etching of semiconductor material to produce an article...

310309, 310 40MM, 216 46, H01L 21302

Patent

active

054178010

ABSTRACT:
A process in which micromechanical bushings can be made and the application of such process to making micromechanical devices. Bushings are made on a surface of a stationary structure extending from a planar surface. The bushings are separated from the stationary structure by a sacrificial layer. The stationary structure, the bushing and the planar surface are then further processed by coating with a second sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by a curved, undercut edge such as gear on stool. Final processing includes removing both sacrificial layers to free the movable structure, the bushing, and the stationary structure from each other. The bushing is trapped between the movable structure and the stationary structure but able to move freely.

REFERENCES:
patent: 4943750 (1990-07-01), Howe et al.
patent: 4997521 (1991-03-01), Howe et al.
patent: 5043043 (1991-08-01), How et al.
patent: 5149397 (1992-09-01), Bol
patent: 5151153 (1992-09-01), Bol
patent: 5191251 (1993-03-01), Paratte
patent: 5252881 (1993-10-01), Muller et al.
patent: 5331236 (1994-07-01), Sexton

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