Process skew results for integrated circuits

Details Process skew results for integrated circuits Process skew results for integrated circuits

2006-03-28

2006-03-28

Smith, Matthew (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

07020859

ABSTRACT:
A method of performing a characterization of an integrated circuit design that is customized during succeeding fabrication steps. The characterization is accomplished with respect to different levels of a processing parameter that is fixed during preceding fabrication steps. A wafer is processed through the preceding fabrication steps, including processing the wafer at at least one of the preceding fabrication steps using processing that produces the different levels of the processing parameter within different integrated circuits on the wafer. This produces a standardized characterization wafer. The standardized characterization wafer is processed through the succeeding fabrication steps using customized processing to produce a customized characterization wafer. The integrated circuits on the customized characterization wafer are tested to determine which of the different levels of the processing parameter produces integrated circuits having desired characteristics.

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