Process related to a modified polishing pad for polishing

Details Process related to a modified polishing pad for polishing Process related to a modified polishing pad for polishing

1995-05-15

1997-10-07

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566451, 156345LP, 716 88, H01L 21306

Patent

active

056743521

ABSTRACT:
The present invention includes a modified polishing pad and methods on how to form and use the polishing pad. In one embodiment, a modified polishing pad is formed similar to polishing substrates except that the modifying pressure should be large enough to mechanically deform part of the polishing pad. The modifying pressure is typically at least 10 pounds per square inch. The materials used to modify the pad should be hard with a smooth surface. Examples of these materials are metals, dielectrics, and semiconductors. After modifying the polishing pad, it may be used to polish semiconductor substrates. Compared to a fresh pad, the modified polishing pad should have a higher planarization efficiency and be less likely to cause corner rounding of a patterned layer adjacent to an opening.

REFERENCES:
patent: 4842678 (1989-06-01), Noro et al.
patent: 5096854 (1992-03-01), Saito et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5611943 (1997-03-01), Cadien et al.

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