Process of removing residue material from a precision surface

Semiconductor device manufacturing: process – Chemical etching

Reexamination Certificate

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C438S712000, C438S745000

Reexamination Certificate

active

06890855

ABSTRACT:
A process of removing residue from an etched precision surface. In this process the etched precision surface is contacted with a composition which includes liquid or supercritical carbon dioxide and a fluoride-generating species.

REFERENCES:
patent: 4506092 (1985-03-01), Lentz et al.
patent: 4678737 (1987-07-01), Schneller et al.
patent: 5738082 (1998-04-01), Page et al.
patent: 5868916 (1999-02-01), Moulton
patent: 5897349 (1999-04-01), Agnello
patent: 5904570 (1999-05-01), Chen et al.
patent: 5908510 (1999-06-01), McCullough et al.
patent: 5925501 (1999-07-01), Zhang et al.
patent: 5976264 (1999-11-01), McCullough et al.
patent: 5980770 (1999-11-01), Ramachandran et al.
patent: 5981454 (1999-11-01), Small
patent: 6056895 (2000-05-01), Kirsch et al.
patent: 6316057 (2001-11-01), Hirayama et al.
patent: 6331487 (2001-12-01), Koxh
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6387859 (2002-05-01), Ho
patent: 6451926 (2002-09-01), Kuo et al.
patent: 6500605 (2002-12-01), Mullee et al.
Kirby et al., Chem Rev, 99, 565-602 (1999).
Moreau, Semiconductor Lithography, 647, Plenum Press, 1988.
Alm, Modern Coating, Oct., 1980.
Alm, J. Coating Tech, 53, No. 683, 45-50 No. 683, 45-50, Dec. 1981.

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