Process of producing semiconductor device

Details Process of producing semiconductor device Process of producing semiconductor device

1989-03-10

1991-02-19

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437217, 437219, H01L 2102

Patent

active

049944118

ABSTRACT:
A process of producing a semiconductor device involving the steps of providing a lead frame having inner leads spaced from each other and connected together by a connecting portion; bonding a layer of an insulating material to the connecting portion and to surrounding portions of the inner leads; removing the connecting portion and a portion of the layer of insulating material to form end portions of the inner leads which are separated from each other and retained in a spaced arrangement by a remaning portion of the layer of insulating material; joining a semiconductor chip having bonding pads to the end portions of the inner leads; connecting the bonding pads on the semiconductor chip and the inner leads by wires; and encapsulating the semiconductor chip, the remaining portion of the layer of insulating material, the inner leads and the wires within a resin material; a peripheral portion of one face of the semiconductor chip partially overlapping faces of the end portions.

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