Process of producing galvanic layers of solder of precise contou

Details Process of producing galvanic layers of solder of precise contou Process of producing galvanic layers of solder of precise contou

1985-08-15

1987-02-03

Kellogg, Arthur

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156666, 156667, C23F 102, C25D 502, B44C 122

Patent

active

046407391

ABSTRACT:
Very fine solder-coated conduction paths are made on ceramic, glass or enamel substrates by the combination of a first step in thick-film technology followed by the photo-masking and etching steps typical of thin-film technology, after which galvanic reinforcement of the initial calcined copper paste layer is performed in the locations where the initial layer is exposed by the developed mask. A lead-tin solder layer is then galvanically deposited, which is thicker than the mask, after which the mask is removed and the newly exposed portions of the initial copper layer are etched away. A reflow treatment of the solder layer pattern consolidates the solder layer by melting on top of the boundaries of the unetched initial copper layer. It is possible to obtain conduction path spacings down to 50 .mu.m with conduction paths coated with solder that have excellent adhesion to ceramic, glass or enamel substrates.

REFERENCES:
patent: 4024631 (1977-05-01), Castillero
patent: 4420365 (1983-12-01), Lehrer
patent: 4487654 (1984-12-01), Coppin

Affiliated with

Also associated with

Rating

Process of producing galvanic layers of solder of precise contou does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of producing galvanic layers of solder of precise contou, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of producing galvanic layers of solder of precise contou will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1090379