Process of producing a printed wiring board

Details Process of producing a printed wiring board Process of producing a printed wiring board

1979-03-26

1981-01-06

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29847, 156150, 156252, 156634, 156902, 174 685, 204 15, 204 24, 427 97, 428902, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

042434742

ABSTRACT:
This invention relates to a process of producing a printed wiring board having first and second electrically conductive circuit layers provided on an insulating laminate. The insulating laminate includes a first insulating layer having metal foils provided on both sides thereof and a second insulating layer which is attached to one of the sides of the first insulating layer so as to place one of the electrically conductive circuit layers between the first and second insulating layers. The first electrically conductive circuit layer is formed in a predetermined pattern by printing and etching one of the metal foils. Then, connecting through-holes are formed in the first insulating layer across the first electrically conductive circuit layer and the remaining metal foil. The second insulating layer is attached onto the first insulating layer so that the first electrically conductive circuit layer is covered with the second insulating layer. Thereafter the second electrically conductive circuit layer is formed in a predetermined pattern from the remaining metal foil by printing and etching.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 3471631 (1969-10-01), Quintana
patent: 3566005 (1971-02-01), Shaheen

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