Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1996-04-25
1999-06-29
McPherson, John A.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430313, 430311, 430319, G03C 500
Patent
active
059167360
ABSTRACT:
A process of manufacturing a printed circuit board having plated landless through-holes involves filling a radiation curable putty material in through-holes plated with copper in a substrate, exposing the material under radiation of light in order to cure the material, placing a liquid resist on the substrate surface, covering a mask over the resist, exposing the resist layer by using a mask having a circuit pattern, developing the resist, etching the substrate surface, and removing the cured putty material in the through-holes and the remaining portion of the resist. The filling material composition used in the process comprises hydrophthalic mono ester compound as a component (A), a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B), a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of cure depth of the material after exposure of light as a component (C), and a powder of at least one extender selected from polyethelene, nylon, polyester, talc, silica, aluminum hydroxide, titanium oxide, barium sulfate, kaolinite, calcium carbonate, and phthalocyanine as a component (D).
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English translation of JP 58-202440.
English translation of JP 7-331149.
Doi Katsuo
Miyayama Satoshi
Oda Toshikazu
Ashton Rosemary
Goo Chemical Co., Ltd.
McPherson John A.
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