Process of making semiconductor device using focused ion beam fo

Details Process of making semiconductor device using focused ion beam fo Process of making semiconductor device using focused ion beam fo

1994-03-23

1996-12-03

Fourson, George

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437 22, 437 24, 437184, 437228, 437936, 437937, H01L 21306

Patent

active

055804195

ABSTRACT:
Disclosed is a method for producing ultra dense and ultra fast integrated circuits utilizing an advanced ion beam processing system. An exposure chamber which supports a focused ion beam column and an ancillary chamber, both of which are maintained under ultra high vacuum are utilized to perform resistless in-situ etching, deposition, implantation and oxidation processes. By performing these processes within the exposure chamber and the ancillary chamber which contains various connecting chambers, ultra dense and ultra fast integrated circuits can be produced with reduced manufacturing steps thereby increasing production yield and throughput.

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