Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate
2007-07-20
2011-11-01
Vu, Hung (Department: 2811)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
C438S977000
Reexamination Certificate
active
08048775
ABSTRACT:
A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.
REFERENCES:
patent: 6162702 (2000-12-01), Morcom et al.
patent: 7507638 (2009-03-01), Mancini et al.
patent: 7592235 (2009-09-01), Nanjo
Feng Tao
Tai Sung-Shan
Alpha and Omega Semiconductor Incorporated
Cai Jingming
Schein & Cai LLP
Vu Hung
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