Process of forming integrated circuits with contact pads in a st

Details Process of forming integrated circuits with contact pads in a st Process of forming integrated circuits with contact pads in a st

1986-10-09

1987-08-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437209, 437827, 156644, 156653, 156657, 1566591, 156901, 357 70, B44C 122, B29C 3700, H01L 2348, H01L 2944

Patent

active

046859985

ABSTRACT:
An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

REFERENCES:
patent: 3698074 (1972-10-01), Helda et al.
patent: 3823467 (1974-07-01), Shamash et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4510017 (1985-04-01), Barber
patent: 4531285 (1985-07-01), Lucas

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