Process of forming a dual overhang collimated lift-off stencil w

Details Process of forming a dual overhang collimated lift-off stencil w Process of forming a dual overhang collimated lift-off stencil w

1992-08-06

1993-11-02

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430317, 430324, 427 96, 427534, 156643, 156646, 156652, 156653, 156655, 20419236, G03F 736, G03F 742

Patent

active

052582647

ABSTRACT:
A process and structure for depositing metal lines in a lift-off process is disclosed. The process comprises the deposition of a four-layer structure or lift-off stencil, comprising a first layer of a lift-off polymer etchable in oxygen plasma, a first barrier layer of hexamethyldisilizane (HMDS) resistant to an oxygenplasma, a second lift-off layer and a second barrier layer. Once these layers are deposited, a layer of photoresist is deposited and lithographically defined with the metal conductor pattern desired. The layers are then sequentially etched with oxygen and CF.sub.4, resulting in a dual overhang lift-off structure. Metal is then deposited by evaporation or sputtering through the lift-off structure. Following metal deposition, the stencil is lifted-off in a solvent such as N-methylpyrroldone (NMP).

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