Process of fabricating three-dimensional semiconductor device

Details Process of fabricating three-dimensional semiconductor device Process of fabricating three-dimensional semiconductor device

1985-07-17

1986-09-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29576J, 29591, 148 15, 156634, 156643, 156653, 156656, 156657, 1566591, 156668, 1563073, 357 71, 427 89, 430313, 430314, 430317, 430318, B44C 122, B29C 1708, C09J 502, C23F 102

Patent

active

046120831

ABSTRACT:
A process of fabricating a three-dimensional semiconductor device, comprising the steps of preparing at least two multilayer structures each including at least one semiconductor element and a conductor connected at one end to the semiconductor element and having at the other end an exposed surface, at least one of the multilayer structures further including a thermally fusible insulating adhesive layer having a surface coplanar with the exposed surface of the conductor, positioning the multilayer structures so that the exposed surfaces of the respective conductors of the multilayer structures are spaced apart from and aligned with each other, moving at least one of the multilayer structures with respect to the other until the exposed surfaces of the conductors of the multilayer structures contact each other, and heating the multilayer structures for causing the insulating adhesive layer of at least one of the multilayer structures to thermally fuse to the other multilayer structure with the semiconductor elements electrically connected together.

REFERENCES:
patent: 4400868 (1983-08-01), Antypas et al.
patent: 4552607 (1985-11-01), Frey

Affiliated with

Also associated with

Rating

Process of fabricating three-dimensional semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of fabricating three-dimensional semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of fabricating three-dimensional semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1993951