Process for treatment of semiconductor wafers in a fluid

Details Process for treatment of semiconductor wafers in a fluid Process for treatment of semiconductor wafers in a fluid

1997-08-08

1999-06-15

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 254, 134 26, 134 30, 134 31, 134 37, 134902, B08B 304, B08B 500

Patent

active

059118377

ABSTRACT:
A process for removing organic materials from semiconductor wafers and a process for chemical solvent drying of wafers. In the drying process, a wafer submerged in a bath having a lower aqueous layer and an upper organic layer is lifted from the lower aqueous layer up through the upper organic layer and removed from the bath.

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